配方类型：	ADHESIVES
配方说明：	Non-Sag Elevated Temperature Cure Encapsulation Compound
配方组成：	this compound would find application in areas where a non-sag compound is desired for gun or transfer molding application and elevated temperature cure. Pot life is over 1 hour at 200F "Mistron" Vapor Talc/70 Stearic Acid/1 MPC 66 Black/5 Para-quinone dioxime/4 Pb3O4/10 "Altax"/4 "Whitetex" Clay/30 ZnO/5 "Enjay" Butyl LM 430/100 "Maglite" K/5 "Flexon" 845/50 Molecular Sieve 4A/5

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