化学配方数据库
| 配方类型: | ADHESIVES |
| 配方说明: | Binders for High Melting Masses |
| 配方组成: | Bond Clay/10-20 Formula No.5 (Quartz a) Corundum (4-5 mm grain size)/75-80 Bond Clay/10-15 "Aluphos" (approx. 5% of bond clay may be replaced by calcined "Giulini" alumina CT 38)/5-10 b) Corundum (4-5 mm grain size)/80 Bond Clay/20 "Aluphos" (relative to the quantity of the two above components)(approx. 5% of bond clay may be replaced by calcined "Giulini" alumina CT 38)/5-10/10 c) Corundum (0-4 mm grain size)/90 Bond Clay/10 "Aluphos" (relative to |
| 配制方法: | In order to use "Aluphos" successfully, the addition of 5-10% bond clay to the refractory mass, and a suitable granulometry are necessary. In addition, the molded parts have to be of an adequate density which can be obtained by either ramming or pressing. Molding by means of |
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