配方类型：	METALS AND TREATMENTS
配方说明：	Copper Plating
配方组成：	Average Current Density, no agitation/75-125 amp/sq ft Copper Metal (Cu)/60 g/l Limiting* Current Density at 80F/150 amp/sq ft Limiting* Current Density at 120F/250 amp/sq ft Operating Conditions pH (colorimetric)/0.8 to 1.7 Average Tank Voltage/3-5 *Maximum Current Density without burning based on laboratory in thickness using no agitation. Boric Acid/15 g/l Temperature/80-170F Copper Fluoborate (Cu(BF4)2)/224 g/l Cathode Current Density: Baume at

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