化学配方数据库
| 配方类型： | METALS AND TREATMENTS |
| 配方说明： | Electroless Lead Plating |
| 配方组成： | Thiourea/35 g Dimethyl sulfoxide/175 ml Lead nitrate/35 g |
| 配制方法： | At a temperature of 45C a smooth, bright lead deposit was obtained on copper. The authors did not try the method on other basis metals; however, if it is unsuitable on steel, a light copper plate could be applied first. |
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