配方类型：	METALS AND THEIR TREATMENT
配方说明：	Cleaning Solder Surfaces
配方组成：	A dip, commonly employed to clean up solder surfaces and to remove the sulfate film left by etching consists of the following Thiourea/13 oz/gal 48% fluoboric acid/13 fl oz/gal
配制方法：	This requires about 1-3 minutes at 110-130F, and a nonionic wetting agent can be added for smoother action.

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