化学配方数据库
| 配方类型: | METALS AND THEIR TREATMENT |
| 配方说明: | Copper Plating Baths for Printed Circuits |
| 配方组成: | Sodium cyanide/4.6 oz/gal FORMULA No.4 Sulfate Copper Current density/25 amp/ft^2 Cost/gal/$2.00 cost/gal/$0.55 pH/12.5 oz/gal Pyrophosphate Copper: Proprietary salts/45 oz/gal Ammonia/0.7 fl. oz/gal "Temperature"/130-140F Agitation/Air Sodium carbonate/4.0 oz/gal Current density/40 amp/ft^2 Cost/gal/$1.70 Temperature/140F Copper cyanide/3.5 oz/gal copper sulfate/30 oz/gal Sulfuric acid/8 oz/gal Brightener/70-75F |
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