配方类型：	METALS AND THEIR TREATMENT
配方说明：	Improved Copper Plating
配方组成：
配制方法：	The poor adhesion of copper deposited on steel by chemical replacement using a copper salt in acid solution can be overcome by using Ethoquad C/12 in the salt formulation. In the electroplating of copper the brightness can be increased by adding small quantities of Ethoquad C/25 or Ethoquad 18/25 to the plating.

返回数据库查询